Chipboard (KSP board) – compact BIS panel (warm floor)

21.83 24.50  (ar PVN 21%)



  • water floor and wall heating (without concrete – dry method)
  • building renovations
  • frame construction
  • modular construction

ALMEKO Technologies warm floor solutions (LV catalog)
ALMEKO Technologies warm floor solutions (EN catalog)

SKU: CB kompakt BIS panelis Category: Tags: ,


Milled MFP plates, used with profiled aluminum plates or covered with aluminum foil / metallized foil

  • serves as an additional construction layer
  • greater strength than OSB
  • resistant to loads
  • moisture resistant
  • thermal insulation
  • sound isolation
  • not flammable
  • vapor permeable
  • resistant to the development of fungi and mold
  • allows to reduce the construction layer to 22 mm
  • groove spacings and diameters are adapted to sanitary installations
  • quick and easy assembly
  • low load on supporting structures
  • floor heating is not required
  • mounting directly on the support structure

Additional information